Besi Switzerland AG

BE Semiconductor Industries (Besi) is a global developer and manufacturer of advanced semiconductor assembly equipment and process solutions. Besi’s portfolio targets leadframe, substrate and wafer-level packaging applications and includes product lines such as Datacon, Esec, Fico and Meco used for die bonding, flip chip, molding, singulation, plating and wet processing. The company serves a broad set of end markets including electronics, mobile internet, cloud servers, computing, automotive, industrial, LED and solar energy. Besi emphasizes R&D, process technology and smart manufacturing initiatives and participates in collaborative research and EU projects to advance packaging technologies. In addition to capital equipment sales, the company provides after-sales services including spare parts and tooling, customer support, process development and training. Investor relations, sustainability reporting and corporate governance are prominent on the site, reflecting a publicly listed, global organization with multiple headquarters/locations and a focus on continuous product and process innovation. Besi positions itself as a full-scope equipment and service partner for semiconductor manufacturers aiming to improve assembly throughput, yield and cost-efficiency.